CONXNEC

Server Liquid Cooling Solutions

Keep high-density compute running cool

Cold plate liquid cooling, immersion cooling and CDUs for AI data centers, high-performance computing and enterprise data centers — with end-to-end service from design to operation.

  • Cold plate
  • Immersion
  • CDU
  • Turnkey solutions

WHY LIQUID COOLING

Why liquid cooling

As chip power keeps rising, air cooling is approaching its limits. Liquid cooling uses liquid as the heat-transfer medium and removes heat right at the source.

Efficient heat removal

Liquids carry and conduct heat far better than air, reliably removing heat from high-power CPUs and GPUs and keeping chips cooler and more stable.

Lower energy use

Less reliance on server fans and precision air conditioning lowers cooling energy, helping data centers reduce PUE and operating costs.

Higher density

Supports higher power per rack, fitting more compute into the same footprint and saving floor space.

Quiet and stable

Lower fan speeds and noise, and less exposure to dust and vibration, help equipment run reliably over the long term.

PRODUCTS

Products & solutions

Covering the key parts of a liquid cooling system, combined and customized for each project.

01

Cold Plate Liquid Cooling

冷板式液冷

Custom cold plates for high-power CPUs and GPUs. Coolant flows through the plate's channels and carries heat directly away from the chip. Works with mainstream server form factors — for new builds and retrofits alike.

  • CPU / GPU cold plates
  • Custom channels
  • Retrofit-ready
02

Coolant Distribution Unit

CDU 冷量分配单元

Links the facility and IT cooling loops, controlling coolant temperature, flow and pressure, with status monitoring and alarms. Available as in-rack and in-row units.

  • In-rack / in-row
  • Temperature & flow control
  • Monitoring
03

Immersion Cooling

浸没式液冷

Servers are fully immersed in dielectric coolant that removes heat directly — no server fans needed. Suited to ultra-high power density.

  • Single-phase
  • Ultra-high density
  • Fanless
04

Rack Manifolds & Components

液冷机柜与歧管

Rack-level manifolds, quick disconnects and piping assemblies with a modular design that simplifies deployment, expansion and maintenance.

  • Manifolds
  • Quick disconnects
  • Modular

SERVICE

End-to-end solutions & service

From assessment to long-term operation, we support your project at every step.

  1. 01

    Assessment

    Compute scale, facility conditions and cooling goals

  2. 02

    Design

    System selection, thermal simulation and piping design

  3. 03

    Production & QA

    Manufacturing and quality inspection of key parts

  4. 04

    Deployment

    On-site installation, commissioning and acceptance

  5. 05

    Support

    Monitoring, routine inspection and technical support

APPLICATIONS

Applications

AI data centers

GPU clusters run hot and dense; liquid cooling keeps chip temperatures stable under heavy load.

High-performance computing

Research computing, simulation and rendering clusters running at full load for long periods.

Data center retrofits

Bring liquid cooling into existing facilities to cut cooling energy and raise rack density.

Edge & high-density rooms

Compact deployments where space and cooling capacity are limited.

ABOUT US

About CONXNEC

CONXNEC is a company dedicated to server liquid cooling, delivering efficient, energy-saving and reliable cooling for high-power computing equipment.

From core liquid cooling components to system integration, we help customers keep energy use and operating costs under control as their computing power grows.

  • Liquid cooling components
  • System integration
  • Design & technical support

CONTACT

Contact us

Reach out for product information, technical solutions or partnership inquiries.

Salessales@conxnec.com

Send an email